IMAPS-UK One Day Technical Seminar:

UK Microelectronics Packaging Society (IMAPS-UK) is holding a second one day technical seminar and industry networking event in conjunction with The National Physical Laboratory (NPL) at the NPL, Teddington TW11 0LW, on the 21 March 2012

The event will provide the opportunity for:

•    Technology updates on new exciting interconnection processes & materials
•    Networking between end-users, supply chains and technology providers
•    Business development opportunities for your Company & its products

Introduction:
As engineers are presented with the challenge of fitting more functionality into smaller spaces, getting more power out of devices, dissipating increasing levels of heat from components and ensuing improved levels of reliability, the methods used for interconnect are often key in achieving these goals.

The IMAPS-UK “Beyond Solder” Series of Technical Seminars investigate the different interconnection methods being used and developed today, which overcome these challenges, these include:

•    Ultrasonically bonded interconnects
•    Reliable connections for harsh environments
•    Conductive adhesives for chip bonding
•    Press-fit connections for high reliability applications
•    Welding of ultra thin wires & ribbons
•    Nano-scale interconnects
•    Innovative die & component attach materials
•    Industrial “Solder Free” connections

Who Should Attend:
Research & Development Engineers, Scientists, Production & Manufacturing Engineers, Supply Chain Companies, Process Engineers, Product Designers & Students

Summary of Technical Programme:
The Seminar will comprise eight technical presentations in four sessions, with coffee & lunch breaks in between. These will be followed by a general discussion, which will review and asses the challenges in packaging that need to be addressed for different applications. There is also ample opportunity for networking with fellow delegates from leading companies and institutions in the UK.

Table Top Exhibition:
In addition, there is a complementary tabletop exhibition showcasing leading companies in the field, including

Registration:
The event is open to all including non IMAPS-UK members but space for the event is strictly limited. Please complete the attached booking form and email it to: This e-mail address is being protected from spambots. You need JavaScript enabled to view it to avoid disappointment. - The previous event in this series sold-out so early booking is recommended.

Schedule:

Seminar Fee:
IMAPS, NPL, TWI, UK-NMI & IeMRC Members: £40 + VAT
Non-Member: £60 + VAT
Students: £30 + Vat
Prices include lunch and refreshments

Interested in Exhibiting?
IIs your Company interested promoting itself to delegates who are attending to learn about the latest “Interconnection Technology & Materials”? Then reserve your tabletop without delay! Ten exhibits available on a first-come, first served basis (no more than one per Company). Exhibitors are also offered the opportunity to provide a two minute presentation introducing their Company to the delegates.

IMAPS-UK Corporate Member Tabletop Exhibit: £195 +VAT
Other Tabletop Exhibit: £295.00 + VAT

Sponsorship
Sponsorship opportunities are also available; please contact IMAPS-UK for further details.

Accomodation
Click HERE for a list of local hotels close to the venue.

IMAPS-UK would like to extend its gratitude to the following event sponsors:

For further information, please contact:

Telephone: 0131 202 9004

Email: This e-mail address is being protected from spambots. You need JavaScript enabled to view it