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Home Events Details - RaMP RF and Microwave Packaging

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Event 

RaMP RF and Microwave Packaging
Title:
RaMP RF and Microwave Packaging
When:
21.03.2012
Where:
iSLI - Institute of System Level Integration - Edinburgh
Category:
IMAPS-UK Events

Description

IMAPS-UK One Day Technical Seminar - RaMP

IMAPS-UK present a one day workshop on the topic of Packaging of RF and Microwave devices

RF components and systems present significant and unique challenges. Careful considerations over substrate, materials and processes are required in order to meet cost, power, thermal, signal integrity, operation and performance specifications. The continual requirements to improve these parameters as well as the introduction of novel techniques and applications at ever expanding frequency ranges are putting increasing demands on the design and packaging engineers.

This seminar will bring together engineering and scientific experts from the worlds of academia and industry to discuss the latest RF and microwave packaging technologies and applications as well as a platform to highlight current commercial issue and needs.

Summary of Technical Programme:

The conference will comprise eight technical presentations, divided into in four sessions, with refreshment & lunch breaks in between. 

The schedule is also designed to provide ample opportunity for networking with fellow delegates from leading organisations and institutions and to allow time to review the tabletop displays from exhibiting Companies. 

Who Should Attend:

End Users, Research & Development Engineers, Scientists, Production & Manufacturing Engineers, Supply Chain Companies, Process Engineers, Product Designers & Students

Registration & Seminar Fees - Click HERE to Register:

Recent IMAPS-UK seminars have received excellent feeback and in some instances sold-out, we therefore recommend early bookings to avoid disappointment!

IMAPS-UK Member - £40 
Non-member - £65
Student member - £30 * First five registered IMAPS-UK Student Members places are free!

Exhibitor (member) - £195
Exhibitor (non-member) - £295

All prices plus VAT. and include lunch and refreshements, event programme and proceedings.

Sponsorship opportunities:

Interested in sponsoring one of the following at RaMP to raise your Company profile:

Main Event Sponsor
Refreshments sponsor
Lunch sponsor
Programme/ proceedings sponsor  

Then please contact us for pricing and benefits of each Sponsorship package.


For further information, please contact:

IMAPS UK Secretariat
25 Focus Way,
Andover,
Hampshire
SP10 5NY

Telephone: 0131 202 9004

Email: This e-mail address is being protected from spambots. You need JavaScript enabled to view it

Venue

Venue:
iSLI - Institute of System Level Integration   -   Website
Street:
Research Avenue North
ZIP:
EH14 4AP
City:
Edinburgh
Country:
UK

Description

The Institute for System Level Integration provides postgraduate education, professional training and research in system level integration and system-on-chip technologies. Its aim is to support the development of  electronics systems design worldwide and to encourage the exploration of new technologies through research.

The Institute is a unique academic collaborative venture of four of the UK's leading universities: Edinburgh, Heriot-Watt, Glasgow and Strathclyde, and with links to the University of the West of Scotland and Lancaster University who bring key skills in the use of MEMS technology.

Under the banner of the UK MNT Network, iSLI has established a publicly accessible design centre focused on silicon based MEMS technology. Partnered with Semefab's 'SemeMEMS' foundry service and using leading edge Coventorware design tools, iDesign provides the commercial sector with access to expertise and knowledge transfer for the rapid development of product prototypes. Targeted high value added development areas include advanced sensing, bio-medical, photonics, micro-fluidics, and integrated control applications