IMAPS United Kingdom

Event: RaMP - RF & Microwave Packaging One Day Workshop

IMAPS-UK present a one day workshop on the topic of Packaging of RF and Microwave devices

RF components and systems present significant and unique challenges. Careful considerations over substrate, materials and processes are required in order to meet cost, power, thermal, signal integrity, operation and performance specifications. The continual requirements to improve these parameters as well as the introduction of novel techniques and applications at ever expanding frequency ranges are putting increasing demands on the design and packaging engineers.

This seminar will bring together engineering and scientific experts from the worlds of academia and industry to discuss the latest RF and microwave packaging technologies and applications as well as a platform to highlight current commercial issue and needs.

Papers are sought for consideration for both oral and poster presentation in the areas of:

•    Emerging Technologies
•    Design and materials
•    RF Simulation and Modelling Case-studies and Techniques
•    New & Novel Applications
•    Reliability and Test

Abstracts of 100 words should be submitted to This e-mail address is being protected from spambots. You need JavaScript enabled to view it no later than the 10th of February.”