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Welcome to the IMAPS-UK Homepage

IMAPS - International Microelectronics Assembly & Packaging Society -  is a global community of microelectronic related engineers, scientists, manufacturers, end-users and supply chain companies. 

The Society aims to support the development and growth of the Microelectronics and related industries, and to aid the transfer of knowledge and information. This is achieved through networking, seminars, workshops, short courses, publications, webinars and websites.

Members benefit from access to business networking and events at a reduced rate; technical information & receive society newsletters and other publications. IMAPS is the largest Microelectronic Packaging Society in the World!

IMAPS-UK, a registered Charity is the United Kingdom Chapter of the International Microelectronics Assembly & Packaging Society.

Upcoming Events:

Wire Bonding Workshop 03/12

RaMPMTC - 3rd December

Basics of wire bonding and much more!  - This IMAPS-UK workshop held at the MTC is your opportunity to learn and explore the technologies of Wirebonding processes for packaging and assembly in ELectronics. 

This workshop will cover:

•    Basics of Wire Bonding  
•    Design and Optimisation
•    Application Examples
•    Quality, Testing and Reliability 
•    Technical Case Studies



Low Temperature Joining 28/01

Low temperature JoiningHenkel UK - 28th January

Adhesives technologies

This educational Workshop, organised by IMAPS-UK is being held at the Henkel UK facility and is your opportunity to learn and to explore the technologies of Low Temperature Joining processes for packaging and assembly in Electronics.

Low temperature Joining is now a required and essential packaging technology for products using Flex, Plastic and Printed electronics. The development of materials and adhesives has made significant advances to meet the challenges in designs, materials and environments.
The programme will consist of 5 workshop sessions covering all aspects of the joining process as highlighted above and will include short case studies covering a range of related applications and technologies.
The workshop, which will be limited in numbers, is aimed at electronic system developers, manufacturers and end-users as well as design companies that now need to understand this very important technology area. It will review the key issues of low temperature adhesive bonding and its applications in electronics packaging.

This workshop will cover:

  • An Introduction to the Markets for Flex, Plastic & Printed Electronics Systems
  • Materials & Processes for Successful Low Temp Joining
  • Quality, Testing and Reliability
  • Application Examples




MicroTech 2016

Heriott Watt University - 17th March

IMAPS-UK's MicroTech annual conference returns in 2016 on 17 March at Heriot-Watt University, Edinburgh. With its updated one-day format, MicroTech brings together the entire microelectronics supply chain and is the only UK event dedicated to Micro-Assembly and related technologies.


Important Info

Continuing Professional Development

We are proud to announce that from 2015 we are a CPD member. This represents a big step ahead and a great value for IMAPS-UK members and for all the atendees or our events!


CPD Member

Why become a member?

Member to member exchange

Expand your contacts

Events & Proceedings

Advancing Microelectronics

Affiliated Membership IMAPS NA

Read more