IMAPS - International Microelectronics Assembly & Packaging Society - is a global community of microelectronic related engineers, scientists, manufacturers, end-users and supply chain companies.
The Society aims to support the development and growth of the Microelectronics and related industries, and to aid the transfer of knowledge and information. This is achieved through networking, seminars, workshops, short courses, publications, webinars and websites.
Members benefit from access to business networking and events at a reduced rate; technical information & receive society newsletters and other publications. IMAPS is the largest Microelectronic Packaging Society in the World!
IMAPS-UK, a registered Charity is the United Kingdom Chapter of the International Microelectronics Assembly & Packaging Society.
Micross - 19th May
Dicing is usually the first step of getting a product design out from the wafer fab and into a form where it can be used or packaged as a stand alone item. As die sizes decrease the dicing technologies are being pushed to and beyond typical technology limits. The programme will consist of 5 workshop sessions covering all aspects of the dicing process as highlighted above and will include case studies covering a range of related applications and technologies. This will be followed by a short tour (if desired) of the Micross Norwich Facility. The workshop, which will be limited in numbers, is aimed at electronic component and system developers, manufacturers and end-users as well as design companies that now need to understand this very important technology area. It will review the key issues dicing applications currently used in electronics and device packaging.